BPDA CAS:2420-87-3

3,3',4,4'-Biphenyltetracarboxylic dianhydride, also known as BPDA, is a chemical compound with the formula C18H8O6. It is a white solid that is insoluble in water, but soluble in most organic solvents.

Key word:

BPDA Dianhydride bpda anhydride BPDA

Description

BPDA (3,3',4,4'-Biphenyltetracarboxylic dianhydride) also known as s-bpda or bpda dianhydride, is a raw material for the polyimide resin component of one of the super-engineering plastics.

 

Details of bpda dianhydride

Chemical Name: 3,3',4,4'-biphenyltetracarboxylic dianhydride

Synonyms: S-BPDA; BPDA Dianhydride;Biphthalicanhydride;S-BDPA;3,3',4,4'BPDA fandachem;4,4'-Biphthalic anhydrid;4,4'-BIPHTHALIC ANHYDRIDE;4,4'-biphthalic dianhydride

Classification: Anhydride

Molecule: C16H6O6

Molecule Weight: 294.22

Structural formula:

CAS NO.: 2420-87-3

HS CODE: 2917-3990

Quality Standard: Q/82HL01-2004

 

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Product Specification of bpda dianhydride

ITEM
INDEX
Characteristics White or almost white powder, no bad smell
Assay ≥99.8%
Melting point(°C) 299.0~302.0

Single metal ion (mg/kg)

<1PPM

Package

25kg/fiber drum

Application

Making polymer material,Electronics industry, Chips

 

BPDA Dianhydride Characteristics

  • Physical, mechanical, electrical, and chemical properties under high-temperature conditions.
  • High tensile strength and modulus, and also features outstanding long-term heat resistance.

 

Application of BPDA Dianhydride

  • S-BPDA can be used to synthesize high molecular weight aromatic polyamide fibers. It can also be used to generate hybrid nanocomposite films.
  • BPDA chemical is used for many important information and electronic technology products such as mobile phones and copying machines.
  • Tape automated bonding (TAB), chip on film (COF), lead lock tape, high density flexible printed circuit (FPC), stiffener for FPC, office automation equipment, flexible solar cells, speaker diaphragms (for mobile phones, plasma televisions and car audio, etc.), heavy electric machinery, office automation equipment, thermal control film for satellites, printed circuit boards, metallic substrates, sheet heating elements, heat resistance wires.

 

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